By H. Shih
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Extra info for Corrosion Resistance
Sample text
76] H. Shih, S. I. Chou, and R. Casaes, “D-Chamber Evaluation after Running 12,000 Wafers”, Lam Research Confidential Technical Report, November 11, 2010. [77] D. Song, H. Shih, S. Wu, and H. Haruff, “Systematic Study of D-Chamber Anodization”, Lam Research Confidential Technical Report, February 14, 2011. [78] H. Shih, “Electrochemical Impedance Spectroscopy (EIS) Technology and Applications”, Lecturer for A 8 Hour Short Course Sponsored by the San Francisco Section of the Electrochemical Society, Crown Plaza Hotel, Milpitas, California, June 15, 2006.
Mansfeld, H. Shih, H. Greene, and C. H. Tsai, “ Analysis of EIS Data for Common Corrosion Processes”, in “Electrochemical Impedance : Analysis and Interpretation”, ASTM STP 1188, J. R. Scully, D. D. Silverman, and M. W. , ASTM, p23, 1993. [65] H. Shih and F. Mansfeld, in “New Methods for Corrosion Testing of Aluminum Alloys”, ASTM 1134, edited by V. S. Agatwala and G. M. Ugianksy, ASTM, 180195, 1992. [66] F. Mansfeld, “Analysis and Interpretation of EIS Data for Metals and Alloys”, Schlumberger Technical Report 26, 1993.
Many thanks to Dr. Richard Gottscho, Dr. John Daugherty, and Dr. Vahid Vahedi at Lam Research Corporation. Both Lam Research Corporation and Applied Materials provided the author the opportunity to carry on the systematic study of advanced materials under high density plasma on plasma etching tools. The author would like to express thanks to many individuals during the study of chamber materials through the past 18 years. There have been hundreds of individuals who gave support and encouragement to the author.